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TEC Over View (1)

Te Modules (10)

Sub-Mount (11)

Te Generators (1)

TEC Over View

RMT manufactures a wide range of TE coolers from miniature To high power modules, single stage and multi-stage type, Different DC current values, all with unique custom parameter Options. There are more than 2500 standard types of thermoelectric c...

Te Modules

Sub-mount

Sub-Mount

The thermoelectric sub-assembly is a Peltier module (TE module), mounted on the header. This design is easy to integrate and has a wide range of application: semiconductor lasers, solid-state lasers, photodetectors, CCD array sensors, X-ray receiv...

TE Generators

Te Generators

Thermoelectric generators (TEGs) are used in various applications. Their commercial usage started even earlier than thermoelectric cooling. TEGs found their applications already in the middle of 20th century. Power conversion (direct heat to elect...

MC Series

Te Modules

RMT MC group of thermoelectric coolers has three general Series –MC04, MC06 and MC10. All series are based on standard assembly technology and contain single- and multistage thermoelectric coolers. The difference between MC04, MC06 and MC10 Series...

MD Series

Te Modules

MD Series thermoelectric coolers are based on RMT high-density pellets placement technology. The distance between elements is reduced, comparing with regular technology TECs. This allows to reduce the size of thermoelectric cooler keeping the same...

ML Series

Te Modules

There are two ML thermoelectric coolers Series – ML06 and ML07. Both have the same dimensions and are very common for WDM applications in standard “Butterfly” or DIL packaes. The main difference betweeen ML06 and ML07 Series is in internal element...

MLD Series

Te Modules

MDL06 Series of thermoelectric coolers is developed for telecom applications. It is the analog of regular ML06 Series by main geometry, but MDL06 TECs have up to 100% higher cooling capacity. MDL06 TECs are based on RMT high-density pellets placem...

MX Series

Te Modules

The MX Group of thermoelectric coolers contains w-stage TECs with enlarged cold side and special combination of Imax/Umax parameters. MX TE coolers are developed and optimized mainly for sensing application (X-Ray and IR). Additionally to enlarged...

MDX Series

Te Modules

MDX Series TECs are developed by RMT separately to general 2-stage thermoelectric coolers. MDX TECs have 2 stages and with the same dimensions for hot and cold sides, different to typical pyramidal shape of multistage TE coolers. There are two Ser...

MDC Series

Te Modules

3MDC Series consist of 3-stage thermoelectric coolers with specially enlarged cold side area. 3MDC 3-stage thermoelectric coolers combine the standard RMT assembly technology and HD pellets placement technologies. The result is large cold ceramics...

TOSA Tecs

Te Modules

The trends for small form factor and low power dissipation have made cooled TOSA (Transmitter Optical Sub-Assembly) solutions very popular. RMT Ltd. Provides a range of miniature high-efficient thermoelectric coolers for cooled TOSA applications. ...

TECS with holes

Te Modules

Thermoelectric coolers with holes are used for “external” cooling. Term “external cooling” means TEC attached to the entire assembly on a header, rather than to a heat-generating object. There are two typical cases where thermoelectric coolers wit...

TOSA SUB-Mounts

Sub-Mount

TOSA (Transmitter Optical Sub-Assembly) header is analog of «Butterfly» header. Like «Butterfly» header it use for optical Telecom transmissions and laser diode pumps. But TOSA has a smaller form factor, which allows it used in the pluggable optic...

TO-46 SUB-Mounts

Sub-Mount

TO-46 is a very miniature TO-style package with limited area for mounting and high thermal resistance of sub-mount base. It is suitable for VCSEL, sensors and other miniature electronic components. The material of TO-46 header is usually Kovar coa...

TO-39 SUB-Mount

Sub-Mount

TO-39 header is a very small package for cooling solutions in laser diodes (including VCSEL and DBF lasers), avalanche photodiodes and sensor applications. The material of TO-39 header is usually Kovar or CRS coated with nickel and gold for base a...

TO-37 SUB Mount

Sub-Mount

TO-37 header is a common packaging solution for detector applications. It’s a “diamond”-like analog of TO-39 header. The material of TO-37 header is usually Kovar or cold rolled steel (CRS) coated with nickel and gold for base and pins. RMT Ltd of...

TO-8 SUB-Mount

Sub-Mount

TO-8 is a very common header type in laser and optoelectronics applications. It is suitable for: •DFB Laser Diodes •Quantum Cascade Lasers •Superluminescent Diodes •X-Ray Detectors •Infra-Red Detectors •A...

TO-66 SUB Mount

Sub-Mount

TO-66 header is a “diamond”-like analog of TO-8 header. Like TO-8 header it’s a very common header type in laser and photodetector applications. The material of TO-66 header is usually cold rolled steel (CRS) or Kovar coated with nickel and gold f...

TO-822 SUB Mount

Sub-Mount

TO-822 is increased in size modification of TO-8 header. TO-822 header is good solution for applications where standard TO-8 header is not enough by area. The material of TO-822 header is usually Kovar or CRS coated with nickel and gold for base a...

TO-3 SUB Mount

Sub-Mount

TO-3 header with 8pins is a very common header type for powerful laser diode applications (for example, DFB and DBR lasers). Attached to a proper heatsink TO-3 header is suitable to spread several watts of heat. The available space for mounting is...

Butterfly

Sub-Mount

“Butterfly” packages is the standard format for optical Telecom transmissions and laser diode pumps. The most common type is 14pin package with CuW of CuMo base plate for better thermal conductivity. The open space inside allows to install a therm...

HHL SUB-Mounts

Sub-Mount

HHL header is special box-like high heat load (HHL) package. This is the largest industrial standard header available. HHL headers are typical as a standard packaging solution for solid-state laser pumping in medical and industrial application are...

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